Load-lock type Sputtering System CS 200 is for research & development and small production application.
Substrate transfer capability up to Φ300mm (Deposition performance up to Φ200mm).
Automatic multi-layered deposition by recipe control.
Capable of automatic substrate transfer by simply loading the substrate on to manipulator in the Load-lock chamber.
Cassete chamber available five substrates stocker inside of load-lock chamber.
Co-sputtering and Multi-layer deposition using multi cathodes.
Bias-sputtering available with optional substrate Bias power supply.
Small production purpose