cluster type for advanced electronics Gemini-200,300

Combined deposition and etch modules’ system of cluster type

Gemini 200,300 Series

Gemini is to equip with a variety of different process modules on the same transfer core which makes reducing spare parts by adopting the same common parts as much as possible as well as improves usability with the same operation panel between these different modules. This improves further efficiency for manufacturing process of advanced electronics.

features

  • Multi types of Sputter, Etcher, Asher&PE-CVD modules can be equipped.
  • All types of above modules are made by ULVAC.
  • Up to Φ300㎜ wafer is applicable.

Applications

(Examples follow)

  • Power device   Seed & Metal layer Sputtering
  • MEMS sensor   PZT Sputtering & Etching
  • Opt. device    VCSEL Etching
  • Packaging     Descum Ashing
  • Communication  Insulated film PE-CVD and Etching

specifications

*Not only below, if require others please contact us Below numbers depend on Spec.

 Ultimate
pressure
Stage
temp.
Within wafer unif.
(Ref. only)
UsePlasma source
Sputter<6.7E-5PaCold(Cooling ability T.B.D)~700℃±1~5%Metal, dielectric film,
insulated film
DC
Pulse DC
RF
Etcher<1.0E-3Pa-20~200℃<±5%Metal, dielectric film,
insulated film, Si types
CCP
ISM
(Inductively Super Magnetron、ULVAC Patent)
NLD
(Neutral Loop Discharge、ULVAC Patent)
Asher<0.7Pa50~250℃±5%Descum, desmear, removing sacrified layer, surface treatment, removing PR and PI etchMicrowave
20~80℃Microwave+CCP
PE-CVD<2Pa60~400℃<±1%Insulated film(SiNx,SiOx)Anode coupling
Dual Frequency

system configuration

Varieties of modules can be equipped(Examples follow)

gemini_core_e.png

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